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LG Chemical LUPOY HP5004 PC/ABS, High Impact at Low Temperature | Metasan
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/ LG Chemical LUPOY HP5004 PC/ABS, High Impact at Low Temperature
LG Chemical LUPOY HP5004 PC/ABS, High Impact at Low Temperature
Injection Molding, PC/ABS, General Purpose, High Impact at Low Temperature, High Flow, Heat Resistance.
Packaging
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Unit price
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Delivery location
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Minimum order
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Order quantity
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Additional Information
Applications
Mobile Phone Housing
Advantages
High Flow, High Impact, Heat Resistance
Specifications
Property
Value
Unit
Processing Properties
Dry Time
180 – 300
Injection Molding
min
MFI
5
ASTM D 1238 , Temperature 250 °C -Load 2.16 kg
g/10min
Linear Mold Shrinkage
0.004 – 0.006
ASTM D955
cm/cm
Drying Temperature
80 – 100
Injection Molding
degC
Mold Temperature
80 – 100
Injection Molding
degC
Middle Barrel Temperature
250 – 280
Injection Molding
degC
Mechanical Properties
Elongation at break-MD
100
ASTM D638
%
Tensile strength
54.91
ASTM D638
MPa
Flexural strength
88.25
ASTM D 790
MPa
Flexural modulus-MD
2,255.52
ASTM D 790
MPa
Izod impact strength (notched)
490
ASTM D256-Temperature -30 °C
J/m
Rockwell Hardness
111
ASTM D 785
Izod impact strength (notched)
588
ASTM D256-Temperature 23 °C
J/m
Physical Properties
Specific Gravity
1.14
ASTM D792
Melting range
255 – 285
Injection Molding
degC
Chemical Properties
Humidity content
<0.02
%
Thermal Properties
Flameability
HB
Thickness 0.75- mm
UL RTI
60
Electrical
degC
UL RTI
60
Mechanical with Impact
degC
UL RTI
60
Mechanical without Impact
degC
