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Vestamelt® 930 | Metasan
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Polyamides
/ Vestamelt® 930
Vestamelt® 930
Copolyamide hotmelt adhesive. Used in paste dot, double dot, powder scattering, hotmelt print and extrusion.
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Additional Information
Chemical nature
Copolyamide
Applications
Adhesives > Hot-melts
Advantages
high resistance to heat and steam good adhesion
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Specifications
Property
Value
Unit
Appearance Properties
Physical state
گرانول
Processing Properties
MFI
100
160°C, 2,16 kg
g/10min
Heat Setting Pressure
3 – 5
N/cm2
Heat Setting Time
10 – 15
s
Bond temperature
130 – 150
°C
Physical Properties
viscosity index
1.3
(Solution viscosity (etarel
Melting point
115
Kofler
°C
Melting point
119
°C
Thermal Properties
Tack point
100
Kofler
°C
